On the high strain rate behavior of 63-37 Sn-Pb eutectic solders with temperature effects

This study presents experimental results performed on samples of Eutectic solder material (63 wt. % Sn 37 wt. % Pb). The tests were performed at high strain rates using Split Hopkinson’s Pressure Bar (SHPB). The strain rates were in the range of 400s -1 to 1300s -1 . Heating unit was added to conventional SHPB to vary initial sample temperature conditions. Tests were conducted at room temperature, 60°C and 120°C for the compressive mode, and at room temperature only for the tensile mode. The effects of temperature on the behavior of material were compared. Transient temperature changes during the dynamic loading conditions were calculated by an analytical approach using measured stress-strain data for plastic work. In addition, tests were performed in tension using Tensile Hopkinson’s bar (SHTB) under the same initial temperature condition as for the compression tests. Finally, the constitutive relationship based on the Johnson Cook model was developed.